Stop “eyeball” alignments! Brooks' ALIGN™ series of alignment tools provide a fast, repeatable and highly accurate method of aligning your wafer handling equipment from wafer sorters and inspection tools to cluster tools and equipment front ends. Increase your yield and throughput through more accurate alignments while saving up to 75% of the time required by “eyeball” alignments.
The RC-3003 Robotic Alignment Tool uses optical non-contact measurement sensors to analyze robotic motion. The motion of the wafer is characterized in slots 1-5 and 21-25 in five axes: X, Y, Z, RX, and RY. Using on-screen instructions and “real time” graphical displays, the technician can make accurate adjustments to the machine setup. Numerical readouts provide statistical analysis, while Pass/Warn/Fail labels allow for fast, simple inspection of robots.
| データシート | RC-3003 |
|---|---|
| ユーザーマニュアル | RC-3003 |